By Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Osamu Tabata
ISBN-10: 3527310800
ISBN-13: 9783527310807
Microstructures, electronics, nanotechnology - those massive fields of study are growing to be jointly because the dimension hole narrows and lots of various fabrics are mixed. present examine, engineering sucesses and newly commercialized items trace on the titanic cutting edge potentials and destiny purposes that open up as soon as mankind controls form and serve as from the atomic point correct as much as the seen international with none gaps.Sensor platforms, microreactors, nanostructures, nanomachines, sensible surfaces, built-in optics, monitors, communications expertise, biochips, human/machine interfaces, prosthetics, miniaturized clinical and surgical procedure gear and lots of extra possibilities are being explored.This new sequence, complicated Micro and Nano platforms, presents state of the art experiences from best authors on applied sciences, units and complex structures from the micro and nano worlds.
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Additional info for CMOS-MEMS: Advanced Micro and Nanosystems
Sample text
A cross-section illustration of Analog Devices’ integrated MEMS technology is shown in Fig. 17. The fabrication starts with the front end of the BiCMOS technology, creating n-wells, sources, drains and polysilicon gates for the MOS transistors and bases and emitters for the bipolar transistors. In the course of the front-end circuit process, diffused n+-runners to connect the capacitive microstructures to the on-chip electronics and n+ ground plane regions are formed. After transistor fabrication, the circuit areas are covered with an LPCVD nitride layer and a BPSG (borophosphosilicate glass) layer and the sensor regions are cleared from all dielectrics down to the gate oxide.
Single-crystalline silicon microstructures can be implemented in a pre-CMOS fabrication approach using either SOI (silicon-on-insulator) wafers as substrate material [107–110] or by incorporating sealed cavities using wafer bonding [111, 112]. Originally demonstrated at UC Berkeley [108], the SOIMEMS technology has been further developed by Analog Devices as a next-generation process for the monolithic integration of inertial sensors. 0 lm minimal feature sizes) enabling more on-chip functionality.
The membrane with embedded infrared sensor array has a layered structure comprising the different dielectric layers of the CMOS process with polysilicon and metal structures sandwiched in between them. The overall stress of the layer sandwich without the CMOS passivation is compressive in this example, which could result in membrane buckling. To reduce the overall compressive stress in the membrane, a passivation layer with tensile stress is deposited. 56 MHz) power ratio and chamber pressure in the used PECVD system [63].
CMOS-MEMS: Advanced Micro and Nanosystems by Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Osamu Tabata
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