By John Morton
This ebook contains 15 programming and constructional initiatives, and covers the diversity of AVR chips at the moment on hand, together with the hot Tiny AVR. No previous adventure with microcontrollers is thought. John Morton is writer of the preferred PIC: your individual Introductory path, additionally released via Newnes. *The hands-on means of studying to take advantage of the Atmel AVR microcontroller *Project paintings designed to place the AVR via its paces *The simply publication designed to get you up-and-running with the AVR from sq. one
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Extra info for AVR: An Introductory Course
The slicing equipment includes a wire guiding unit and a tensioning and wire feed-rate mechanism. The wires continually travel in a closed loop by winding up on one spool and unwinding from another. A silicon carbide slurry, which acts as an abrasive, coats the wires prior to cutting through the silicon ingot. 5 hr to cut through all the wafers at once. 4. The wafers are laser marked for identiﬁcation. 5. The sliced wafers are lapped, to remove any imperfections caused by sawing, and then deburred and polished on the top side, to a mirror-like ﬁnish.
A test probe makes contact with the bonding pads on the surface of the wafer, and the chips are electrically tested against predetermined speciﬁcations. Chips thought to be faulty are inked, or an electronic map is developed indicating the bad chips. 10 Die separation. After the chips have been electrically tested, the chips are separated by two different methods: 1. 25 mm): The chips are separated by ﬁrst scribing shallow, ﬁne, diamond-cut lines between the chips and then mounting the wafer onto a release tape afﬁxed to a steel ring.
AVR: An Introductory Course by John Morton