By John Morton

ISBN-10: 0750656352

ISBN-13: 9780750656351

ISBN-10: 1435605527

ISBN-13: 9781435605527

This ebook contains 15 programming and constructional initiatives, and covers the diversity of AVR chips at the moment on hand, together with the hot Tiny AVR. No previous adventure with microcontrollers is thought. John Morton is writer of the preferred PIC: your individual Introductory path, additionally released via Newnes. *The hands-on means of studying to take advantage of the Atmel AVR microcontroller *Project paintings designed to place the AVR via its paces *The simply publication designed to get you up-and-running with the AVR from sq. one

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All rights reserved. Any use is subject to the Terms of Use as given at the website. 5 Metallization. The deposition of a conductive material, to form the interconnection leads between the circuit component parts and the bonding pads on the surface of the chip, is referred to as the metallization process. As chip density increases, interconnection can no longer be accomplished on a single level of metal but requires multilevel metallization with contact holes or vias interconnecting the various levels.

The slicing equipment includes a wire guiding unit and a tensioning and wire feed-rate mechanism. The wires continually travel in a closed loop by winding up on one spool and unwinding from another. A silicon carbide slurry, which acts as an abrasive, coats the wires prior to cutting through the silicon ingot. 5 hr to cut through all the wafers at once. 4. The wafers are laser marked for identification. 5. The sliced wafers are lapped, to remove any imperfections caused by sawing, and then deburred and polished on the top side, to a mirror-like finish.

A test probe makes contact with the bonding pads on the surface of the wafer, and the chips are electrically tested against predetermined specifications. Chips thought to be faulty are inked, or an electronic map is developed indicating the bad chips. 10 Die separation. After the chips have been electrically tested, the chips are separated by two different methods: 1. 25 mm): The chips are separated by first scribing shallow, fine, diamond-cut lines between the chips and then mounting the wafer onto a release tape affixed to a steel ring.

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AVR: An Introductory Course by John Morton

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