By Ken Gilleo
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Additional info for Area Array Packaging Handbook: Manufacturing and Assembly
Flexible circuitry has been used as a chip carrier since the 1960s, but flex-based packages are increasing in popularity today. Several commercial designs are based on thin copper/polyimide circuits. They may be divided into two categories based on the conductor geometry and the resulting package size compared with the chip. 2 times value arbitrarily used to classify CSPs. 2 times chip area to achieve CSP designation (Fig. 11). 10 Ceramic area array packages. Rigid BGA carrier (before and after encapsulation).
Thermal transfer enhancement is such a critical area that it is a separate topic covered in the next subsection. 9 Thermal Management All packages generate some heat because no electronic processes are 100 percent efficient. Their inefficiencies produce by-product heat. Some ICs can produce considerable heat, around 100 W for powerful new CPUs. The faster clock rates, greater number of transistors per chip, and diminishing size of the chip all come together to create a potential thermal catastrophe.
While solder balls can accommodate significant noncoplanarity, adhesive film is much less tolerant. 20 SECTION 1: PACKAGING CONCEPTS AND DESIGNS package, and this is not the case with adhesives. However, smaller packages, especially flip chips, did not present a coplanarity problem. Both isotropic (ICAs) and anisotropic conductive adhesives (ACAs) are used commercially for flip chip assembly. When used with a nickel or gold bump, the adhesive provides a system that is ideal for memory chips because there are no radioactive emissions.
Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo